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Toyo Ink Unveils Nano-Silver Sintering Paste for Enhanced Power Die Bonding

Toyo Ink SC Holdings, the parent company of specialty chemicals firm Toyo Ink Group, has developed a silver nanoparticle paste for die-attach applications. This lead-free material is engineered to meet the needs of next-generation power electronics, capable of sintering at low temperatures under both pressureless and pressure-assisted methods. The silver nanoparticle paste, born from the company’s Corporate R&D Division, caters […]

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