Kanematsu Corporation is set to participate in the upcoming Compound Semiconductor Week 2026, scheduled from May 24 to May 28. The event will be held at Kumamoto-jo Hall in Kumamoto, Japan.
At Booth 15, Kanematsu will feature a range of equipment crucial to the compound semiconductor manufacturing process. These include the MOCVD system by Nippon Sanso Corporation, the ECR Plasma Sputtering System by JSW Afty Co., Ltd, and a Grinder/Polisher by Okamoto Machine Tool Works, Ltd.
Advance registration is necessary for attendance at the international conferences, technical sessions, and exhibition area. The event emphasizes the latest advancements in the compound semiconductor sector. More information on registration can be found on the event's official website.
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