Mitsubishi Heavy Industries, Ltd. (MHI) has announced strategic advancements in infrastructure technologies to address the expanding demands of high-performance computing environments, particularly AI Factory deployments. As these deployments accelerate, infrastructure needs are evolving beyond traditional data centers to industrial-scale environments.
Leveraging its expertise in power systems, cooling technologies, and industrial engineering, MHI is advancing an integrated AI infrastructure portfolio. This portfolio combines advanced cooling, modular systems, and power technologies to support the transition to scalable AI-ready data center infrastructure.
In a significant commercialization milestone, MHI has shipped a 10MW-class centrifugal chiller test unit to the United States. Scheduled to arrive at the Port of Brunswick, Georgia, the shipment is aimed at supporting next-generation high-density AI workloads.
As part of its strategy, MHI is developing the Modular Chiller Plant (MCP), a pre-engineered cooling system that integrates the centrifugal chiller with pumps, heat exchangers, and controls into a modular architecture. The MCP supports NVIDIA DSX-aligned cooling architectures and scalable liquid-cooled AI deployments, simplifying deployment and enabling scalable expansion.
MHI's MCP architecture is designed to enhance Power Usage Effectiveness (PUE) and address water scarcity concerns with its closed-loop configuration, improving Water Usage Effectiveness (WUE) in large-scale data centers. The MCP is currently undergoing U.S. safety and regulatory certification, including UL certification, with the centrifugal chiller shipment contributing to certification readiness.
By reducing onsite integration requirements and supporting future growth, the MCP helps hyperscale, colocation, and AI infrastructure operators manage cooling as computing densities increase. Delivering AI factories at scale requires collaboration across compute, power, and cooling sectors.
NVIDIA DSX, NVIDIA's AI factory-scale platform, unifies design, simulation, operations, and ecosystem technologies. MHI participates in the NVIDIA Partner Network as a Power & Cooling Partner, working with NVIDIA and ecosystem partners to advance integrated power and cooling technologies for NVIDIA DSX.
MHI's solutions are underpinned by its expertise in energy, engineering, and industrial infrastructure systems. The centrifugal chiller is based on proven technology with a strong track record in mission-critical applications, while MHI's advanced power initiatives, including 800VDC, are developed in collaboration with ecosystem partners.
Shin Gomi, Senior General Manager, Data Center & Energy Management at MHI, emphasized the importance of combining advanced cooling technologies, modular design, and industrial engineering expertise with NVIDIA AI infrastructure to enable scalable, reliable, and energy-efficient AI infrastructure.
Vladimir Troy, Vice President of AI infrastructure at NVIDIA, highlighted the role of MHI's work in large-scale cooling and 800 VDC power infrastructure in helping ecosystem partners build more scalable and energy-efficient AI factories.
Looking ahead, MHI plans to expand its integrated AI infrastructure portfolio through technology investments that support the evolving requirements of AI Factory and high-density computing environments.
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