ROHM Co., Ltd. has introduced a new wireless power supply IC chipset, consisting of the ML7670 receiver and the ML7671 transmitter, designed for use in compact wearables such as smart rings and bands. This new development leverages Near Field Communication (NFC) technology to address the challenges associated with charging small wearable devices.
The chipset, building on the foundation of the earlier ML7660 receiver and ML7661 transmitter, provides a maximum power transfer of 250mW. It incorporates peripheral components like switching MOSFETs to optimize both the mounting area and power transfer efficiency, aligning with the power class requirements of compact wearables.
One of the significant advantages of the ML7670 power receiver IC is its ability to achieve a power transfer efficiency of 45% in the 250mW low output range. Its compact form factor, measuring just 2.28 x 2.56 x 0.48mm, is among the smallest in the industry. Moreover, all necessary firmware for wireless power delivery is embedded within the IC, removing the need for a separate host microcontroller unit.
The compatibility with NFC Forum's Wireless Charging (WLC) 2.0 standards ensures that the chipset can transfer power while maintaining compatibility with existing devices, positioning it as a crucial component in the growing NFC wireless power ecosystem.
Already in mass production, the new chipset has been implemented in various applications, including the SOXAI RING 2, the latest sleep-monitoring ring model by SOXAI Inc. launched in December 2025. The adoption of this innovative chipset represents a significant advancement in the design and functionality of next-generation wearable devices.
Potential applications for the ML7670 and ML7671 chipsets extend beyond smart rings and bands to include smart pens, wireless earphones, and other compact devices, paving the way for enhanced wireless charging solutions in the wearable technology market.
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