TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. has introduced a novel gold bump transfer technology designed to enhance the sintered gold bonding process known as AuRoFUSE™ Preforms. This new method allows the formation of gold bumps on semiconductor chips and substrates with complex structures, addressing challenges faced by traditional gold bump formation techniques.
The technology involves initially creating gold bumps on a transfer substrate, which are then transferred to the target semiconductor chip or substrate. This process involves creating openings on a silicon substrate, filling them with gold, and subsequently transferring the gold bumps through heat treatment. This method mitigates the risk of dropping during the process and facilitates easy extraction of the gold bumps.
By manufacturing gold bumps separately, TANAKA's technology allows precise placement on target locations, even on substrates with complex shapes that are difficult to process using conventional photolithography. This innovation is particularly beneficial for semiconductor chips and substrates that are susceptible to damage from stripping solutions.
The company outlines a detailed manufacturing process that includes preparing a silicon substrate, applying photoresist, and using thermocompression to transfer and bond the gold bumps. This process is expected to meet the rising demand for miniaturization and enhanced performance in semiconductors, including applications in optical devices, digital devices, and in-vehicle components.
AuRoFUSE™ Preforms, developed by TANAKA, utilize a paste composed of gold particles and an organic solvent. This paste enables bonding at a relatively low temperature of approximately 200℃, significantly below gold's melting point. The technology offers advantages over traditional soldering and plating methods, which pose risks of short-circuiting and chip damage due to higher pressure requirements.
TANAKA's innovation is poised to contribute to the advancement of next-generation high-density mounting and photonics-electronics integration devices. The company's expertise in precious metal materials, particularly gold, underpins this development, with an emphasis on sustainability and efficient use of limited resources.
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