ROHM Co., Ltd. has launched the TSC3PAK package for silicon carbide (SiC) MOSFETs, offering a top-side cooling design with improved heat dissipation capabilities while supporting high voltages. The advanced technology is designed to enhance the efficiency and reliability of power conversion circuits in onboard chargers (OBCs) and electric compressors within electric vehicles (xEVs). The TSC3PAK package, measuring 14.00 x 18.58 […]















