Kanematsu Corporation has announced its participation in the International Semiconductor Laser Conference (ISLC) 2026, scheduled from June 14 to June 17 at Tampere Hall in Tampere, Finland. As part of its exhibition, the company plans to display a wide array of manufacturing equipment essential for the production of compound semiconductors.
The conference will feature Kanematsu's showcase of technology including the MOCVD system manufactured by Nippon Sanso Corporation, ECR Plasma Sputtering Systems by JSW Afty Co., Ltd, and Grinder/Polishers by Okamoto Machine Tool Works, Ltd. The booth will also highlight equipment manufactured by Opto System Co., Ltd, including a Laser Scriber/Braker, LD Bar Stacker, and Tester.
With a focus on innovation in semiconductor technology, the ISLC 2026 serves as a platform for industry professionals to present advancements and explore opportunities in the field. Kanematsu’s exhibit aims to underscore its capabilities in supporting compound semiconductor manufacturing processes.
Participation in the ISLC 2026 requires advance registration, which is paid and includes access to the conference program, lunch and refreshments, a reception hosted by the City of Tampere, and a conference banquet. Prospective attendees can find more details on the event's official website.
Kanematsu Corporation expressed enthusiasm about the upcoming conference and anticipates engaging with industry peers and potential clients at its booth in Tampere. The company looks forward to demonstrating its innovative solutions and fostering collaborations in the semiconductor sector.
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