Taiyo Holdings Co., Ltd., headquartered in Tokyo, has introduced the 'FPIM Series,' a next-generation semiconductor-packaging material presented at the IEEE Electronics System-Integration Technology Conference (ESTC 2026) in Helsinki, Finland. The FPIM Series represents a significant advancement in semiconductor technology, achieving the first three-layer redistribution layer (RDL) formation with a 700-nm critical dimension (CD) on 12-inch wafers.
The new material, a fine-pitch RDL negative-tone i-line photosensitive insulating product, is designed for dual damascene processes. Co-authored by imec, a leading semiconductor research institute, the paper highlights the Material's ability to support increasingly fine-pitch wiring, essential for modern semiconductor-packaging structures.
This collaboration with imec began in October 2022, and significant progress was made by November 2025, with a co-authored paper detailing the creation of a three-layer RDL structure achieving a 1.6-micrometer CD on 12-inch wafers.
The conducted research showed the FPIM Series achieving a 700-nm CD for interconnects and vias. The 700-nm CD metal 1 layer demonstrated excellent electrical characteristics, such as low leakage current and resistance, confirming the Material's suitability for the chemical mechanical planarization (CMP) process. These developments mark a significant step forward in next-generation interconnect technology for advanced packaging applications.
Looking ahead, Taiyo Holdings aims to develop technologies that achieve RDL formation with a CD of 500 nm or less. This goal involves verifying long-term performance and reliability while advancing the development of materials that enhance semiconductor packaging, specifically for AI semiconductor performance improvements. By 2025, Taiyo Holdings began supplying small-volume samples of the FPIM Series for R&D purposes.
The collaboration between imec and Taiyo Holdings underscores a commitment to innovation in semiconductor technology. Imec, headquartered in Belgium, fosters collaboration with universities and companies worldwide in cutting-edge semiconductor research. Since October 2022, personnel from Taiyo Holdings have been stationed at imec to facilitate ongoing joint research on semiconductor materials, including fine-pitch RDL materials for damascene processes.