Japan Industry News

ROHM Unveils New Top-Side Cooling Package for SiC MOSFETs

ROHM Co., Ltd. has launched the TSC3PAK package for silicon carbide (SiC) MOSFETs, offering a top-side cooling design with improved heat dissipation capabilities while supporting high voltages. The advanced technology is designed to enhance the efficiency and reliability of power conversion circuits in onboard chargers (OBCs) and electric compressors within electric vehicles (xEVs).

The TSC3PAK package, measuring 14.00 x 18.58 x 3.50 mm, introduces a novel heat dissipation structure that places the heat dissipation surface on the top of the package. This configuration allows for automated mounting, bridging the performance gap with conventional through-hole packages like the TO-247-4L, which traditionally posed challenges in achieving lower package profiles due to manual mounting requirements.

SiC devices are increasingly used in xEVs not only for main inverters but also for power conversion circuits. The new package addresses market demand for components compatible with automated mounting by delivering heat dissipation performance similar to that of through-hole technology in a surface-mount format.

ROHM's proprietary groove structure is featured in the TSC3PAK, enabling a long creepage distance of 6.66 mm. This design supports an AC peak voltage of 1200 V in a Pollution Degree 2 environment, ensuring the package's compatibility with widely adopted market products.

The new package utilizes ROHM’s 4th Generation SiC MOSFETs, which feature low ON resistance and high-speed switching characteristics. These innovations lead to significant reductions in switching losses during power conversion, thereby improving application efficiency and reducing power consumption.

Mass production of products using the TSC3PAK package commenced in June 2026, marking an important step in advancing power device technology for both automotive and industrial applications.

For further information, interested parties are encouraged to visit the contact page on ROHM’s official website.

ROHM’s TSC3PAK package shows promise for various applications, including automotive systems like onboard chargers and electric compressors, as well as industrial equipment such as photovoltaic inverters and server power supplies.

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